Multi layer PCB circuit board assembly, PCB R&D and manufacturing services

2024-05-16 09:27:13 hongling

Product Information

Layer: 1-12 l

Substrate: FR4, High-TG FR4, aluminum

Material thickness (mm): 0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4, 3.2

Plate thickness: 0.4mm, 3.2mm

Minimum ring hole: 0.1mm

Hole size (mechanical): 0.2 millimeters

Gold immersed nickel 3-7um Au: 1-5u“

Surface treatment: HAL, ENIG, gold plating, gold immersion, OSP

Copper: IZO

Solder mask: green, blue, black, white, yellow, red, matte green, matte black, matte blue

Screen colors: white, black, blue, yellow

label: Multi layer PCB circuit board assembly, PCB R&D and manufacturing services

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Multi layer PCB circuit board assembly, PCB R&D and manufacturing services

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